Digital Microscope Leica DMS1000 system for digital inspection, observation and measurement. From tiniest detail to an overview, the optics ensures magnification of up to 300x. The built-in HDMI microscope camera provides full high definition live images of up to 30fps and a resolution of 5Mpixels.
Take a fresh look at your samples on a monitor without the need of eyepieces. High-quality, full color still images as well as Full-HD movies are possible.
Ion Beam Milling technique, also known as Ion Beam Etching, is used to achieve a well-prepared sample surface quality for high resolution imaging and analysis. It removes residual artefacts from mechanical cutting and polishing. The ion polished cross-sections and planar samples prepared by Ion Beam Etching can be used for electron microscopy imaging as well as microstructural analysis applications such as EDS, WDS, Auger and EBSD.
The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections and planed surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
Metal sputtering targets are made from high purity metals 99.99%
Standard thickness 0.1 mm (100µm) Other thickness available upon request
Available Diameter Ø 20.0 mm, 20.4 mm, 32 mm, 39 mm, 42 mm, 50 mm, 50.8 mm, 54 mm, 57 mm, 60 mm, 63.5 mm, 75 mm, 76 mm
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