Description
Ion Beam Milling technique, also known as Ion Beam Etching, is used to achieve a well-prepared sample surface quality for high resolution imaging and analysis. It removes residual artefacts from mechanical cutting and polishing. The ion polished cross-sections and planar samples prepared by Ion Beam Etching can be used for electron microscopy imaging as well as microstructural analysis applications such as EDS, WDS, Auger and EBSD.
The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections and planed surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
Leica EM TIC 3X can achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.
The efficiency of an ion beam miller is excellent quality results with high throughput. This system increase the milling rate by a factor of 2 compared to the previous version but the unique triple ion beam system optimizes the preparation quality and reduces working time.
The flexible choice of stages makes the EM TIC 3X a perfect instrument not only for high through-put but also for contract laboratories. Depending on your needs the EM TIC 3X can be configured individually using interchangeable stages:
- Standard stage
- Multiple sample stage
- Rotary stage
- Cooling stage or
- Vacuum Cryo Transfer Docking Station
for applications of standard preparation, high throughput processing, as well as the preparation of extremely heat sensitive samples such as polymers, rubbers or biological materials at low temperatures.
Application
